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I will give myself 10 days to finish the following stuff:
About the lithography and developing
How to etch current wafer?
Oxidation on both sides, then get rid of the oxide on the front side (what method should I use??? RIE or PR??); wet etching the front side; then oxidation again.
Back side is rough, so I got holes on the membrane while etching. Try polishing wafer.(wafer that is polished on both sides) (where are they??)
About etching:
KOH conc. higher, etch rate goes down.
Higher temperature, worse selectivity (SiO2, Si), so I should try lower temperature. Also, I need to monitor the temperature of the KOH solution instead of just setting the hot plate.
TMAH:
better selectivity of SiO2 and Si
need to find out how to do TMAH
To reduce surface resistivity: dope the wafer.
Impurity/dopant increases, resistivity decreases.
Heavy doped material has low resistivity.
Tue, 07 Jul 2020 05:27:41 -0600
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Fri, 16 Sep 2022 20:14:14 -0600
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Fri, 02 Dec 2022 23:57:32 -0700
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Wed, 21 Jun 2023 09:59:08 -0600
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Tue, 25 Jul 2023 06:49:58 -0600
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