Two basic oxidation methods: dry and wet.
dry: slow process, higher quality oxide
wet: quick process for thicker oxide layer, lower quality
Normally, the oxide layer is 100nm-1.5um
Typical thickness of native oxide layer is on the order of 20-30nm
Thu, 29 Sep 2022 21:21:16 -0600
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Tue, 06 Dec 2022 09:33:32 -0700
MEMS devices are often made of materials that are susceptible to oxidation, such as silicon. Oxidation can cause the device to degrade over time, and can also lead to reliability issues. For this reason, it is important to prevent oxidation of MEMS devices, buy homes Whittier or to carefully control the amount of oxidation that takes place.